Filling and Flow Analysis
Visualize epoxy molding compound flow, melt-front progression, pressure, temperature and filling balance throughout the package.
Advanced Semiconductor Packaging Simulation
Moldex3D IC Packaging
Simulate chip encapsulation from filling and curing through cooling and structural evaluation. Predict package defects, optimize mold and runner design, and improve semiconductor-package quality before production.
Improve IC Encapsulation Reliability
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Predict flow balance, incomplete fill and air traps.
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Evaluate wire sweep, die shift and paddle shift.
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Study curing, residual stress and package warpage.
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Optimize advanced packaging processes virtually.
Virtual Chip Encapsulation
Understand interactions between molding compound, chips, wires, leadframes, substrates and package structures before mass production.
IC Packaging Simulation
What Is Moldex3D IC Packaging?
Moldex3D IC Packaging is a specialized CAE solution for simulating semiconductor encapsulation and advanced packaging processes.
Semiconductor packages contain several interacting materials and delicate components, including epoxy molding compound, chips, bond wires, leadframes, substrates, solder bumps and underfill materials.
The software helps engineers visualize how encapsulation material fills the package, cures and cools, and how flow pressure and thermal shrinkage can influence wires, chips, leadframes and final package deformation.
Encapsulation Flow Analysis
Wire and Die Deformation
Curing and Cooling Analysis
Package Warpage Prediction
Software Capabilities
Analyse the Complete IC Encapsulation Process
Study material flow, curing, thermal behaviour, component deformation and structural performance within one simulation-driven engineering workflow.
Air-Trap and Void Prediction
Identify regions where air may become trapped or where incomplete encapsulation and void formation may occur.
Wire-Sweep Analysis
Evaluate bond-wire deformation caused by encapsulation flow forces using fluid-structure interaction methods.
Die and Paddle Shift
Predict movement or deformation of chips, dies, paddles and leadframe structures caused by unbalanced flow pressure.
Curing Analysis
Study thermoset reaction behaviour, curing percentage, temperature development and process-time requirements.
Filler Concentration
Investigate filler migration and concentration distribution in epoxy molding compounds during encapsulation.
Underfill Simulation
Evaluate capillary or molding underfill flow around bumps, chips and substrates in advanced package structures.
Stress Evaluation
Analyse residual stress created by curing, cooling, thermal expansion and material-property differences.
Package Warpage
Predict package deformation caused by thermal and chemical shrinkage during molding and post-mold processing.
Defect Prediction
Identify Packaging Risks Before Production
Detect process and design issues while package geometry, runner layout and manufacturing conditions can still be optimized.
Incomplete Filling
Detect areas where molding compound may fail to completely encapsulate package components.
Air Traps and Voids
Locate potential trapped-air regions caused by unbalanced or converging flow fronts.
Wire Sweep
Estimate bond-wire displacement caused by fluid force during encapsulation.
Die Shift
Evaluate movement of dies and chips under asymmetric filling pressure.
Paddle Shift
Predict leadframe or paddle displacement during transfer-molding processes.
Package Warpage
Study package distortion after molding, cooling and post-mold curing.
Flow Imbalance
Compare filling behaviour across cavities, chips or package regions.
Residual Stress
Identify stress caused by curing shrinkage and mismatched thermal expansion.
Packaging Processes
Support for Conventional and Advanced IC Packaging
Available process capabilities depend on the selected Moldex3D version, package and optional licence modules.
TRANSFER MOLDING
IC Transfer Molding
Analyse epoxy molding compound filling, curing, component deformation and package quality.
COMPRESSION
Compression Molding
Simulate package formation under compression force, temperature and curing conditions.
UNDERFILL
Capillary Underfill
Study capillary resin flow beneath flip chips and around fine solder-bump structures.
WAFER LEVEL
Wafer-Level Packaging
Evaluate encapsulation behaviour and warpage risks in wafer-level package configurations.
PANEL LEVEL
Panel-Level Packaging
Investigate large-format filling balance, thermal behaviour and deformation.
ADVANCED ARCHITECTURE
Multi-Chip and 3D IC
Support advanced package structures containing multiple chips, stacked dies and high-density interconnects.
Simulation Workflow
From Package Design to Process Optimization
Create a repeatable CAE workflow for package modelling, process analysis and reliability improvement.
1
Import Package Geometry
Import chips, wires, substrate, leadframe, runners and encapsulation regions.
2
Prepare Model
Generate the mesh and define package components and material domains.
3
Define Materials
Assign molding compound, chip, wire, substrate and process data.
4
Run Simulation
Calculate filling, curing, cooling, deformation, stress and warpage.
5
Optimize Package
Improve gate design, layout, material selection and process conditions.
Engineering Advantages
Why Use Moldex3D IC Packaging?
Use simulation to improve packaging quality, reduce development risk and support faster process decisions.
Improve Package Quality
Identify filling, wire-sweep, die-shift and warpage risks before physical production.
Reduce Physical Trials
Compare package designs and process conditions virtually before mold trials.
Optimize Gate and Runner Design
Improve filling balance and reduce uneven pressure acting on sensitive package components.
Improve Reliability
Evaluate residual stress and package deformation that can influence long-term performance.
Shorten Development Time
Detect potential defects earlier and reduce repeated design and process iterations.
Control Manufacturing Cost
Reduce rework, scrap and expensive package-design corrections during production development.
Industry Applications
Industries Using IC Packaging Simulation
Suitable for semiconductor companies, packaging houses, material suppliers and electronics manufacturers developing advanced chip products.
Semiconductors
IC design, chip manufacturing and package development.
OSAT Companies
Outsourced semiconductor assembly and testing.
Automotive Electronics
Power devices, controllers, sensors and vehicle ICs.
Consumer Electronics
Mobile, computing, wearable and smart-device chips.
Power Electronics
Power modules, converters, inverters and control ICs.
Telecommunications
High-frequency, networking and communication packages.
Medical Electronics
Diagnostic, monitoring and portable medical systems.
Material Suppliers
Epoxy molding compound and underfill-material development.
Why Choose Rheologist Gaze & Solutions?
Rheologist Gaze & Solutions supports customers in selecting, implementing and applying Moldex3D IC Packaging for semiconductor package-development projects.
- IC Packaging module and licence selection
- Application-focused software demonstrations
- Package geometry and meshing guidance
- Material and processing-data setup support
- Wire-sweep and die-shift result interpretation
- Warpage and residual-stress evaluation
- Application-oriented Moldex3D training
- Local technical and project support
Application Assessment
We review the package architecture, encapsulation process and engineering objectives.
Live Demonstration
Explore relevant IC Packaging capabilities through an application-specific demonstration.
Technical Training
Learn model preparation, process setup, analysis execution and result interpretation.
Simulation Support
Receive support for filling, curing, wire sweep, stress and warpage projects.
Process Optimization
Compare package layouts, gate locations, materials and molding conditions.
Continued Assistance
Obtain ongoing support for Moldex3D usage and IC packaging simulation workflows.
Improve Your IC Packaging Process
Contact Rheologist Gaze & Solutions to evaluate Moldex3D IC Packaging for transfer molding, compression molding, underfill, wafer-level or advanced multi-chip packaging.
Request a Demonstration Contact Our Engineering Team
Moldex3D IC Packaging capabilities may vary according to the
software release, selected licence configuration, materials and
optional modules. Product and company names are trademarks of their
respective owners.