Moldex3D IC Packaging – Licensing Options
Compare the Moldex3D IC Packaging suites based on solver capabilities, simulation functions, molding processes and advanced package analysis requirements.
● Essential Feature Included
○ Optional Feature
Product Portfolio & Features
| Capability | Professional Suite |
Compression Suite |
Dispensing Suite |
Premium Suite |
|---|---|---|---|---|
| Solver Capabilities | ||||
| Parallel Processing | 16 | 16 | 16 | 16 |
| Material Database | ● | ● | ● | ● |
| Mesh Technology – Hybrid, Auto Hybrid, BLM & eDesign | ● | ● | ● | ● |
| Simulation Capabilities | ||||
| Flow | ● | ● | ● | ● |
| Cure | ● | ● | ● | ● |
| Warp | ● | ● | ● | ● |
| Thermal | ● | ● | ● | ● |
| Stress | ● | ● | ● | ● |
| Wire Sweep | ● | ● | ● | ● |
| Paddle Shift | ● | ● | ● | ● |
| Pre / Post Processors | ||||
| Studio | ● | ● | ● | ● |
| Mesh | ● | ● | ● | ● |
| Auto-Hybrid | ● | ● | ● | ● |
| Cadence Interface | ● | ● | ● | ● |
| FEA Interface | ● | ● | ● | ● |
| Optimization | ||||
| Expert / DOE | ● | ● | ● | ● |
| Post Mold Cure (PMC) | ||||
| Chemical Shrinkage of Material | ● | ● | ● | ● |
| Viscoelasticity Stress Relaxation | ● | ● | ● | ● |
Molding Process Licensing
| Molding Process | Professional Suite |
Compression Suite |
Dispensing Suite |
Premium Suite |
|---|---|---|---|---|
| Transfer Molding | ||||
| Transfer Molding | ● | ● | ● | ● |
| Compression Molding (CM) | ||||
| Compression Molding | ○ | ● | ○ | ● |
| No Flow Underfill (NUF) | ○ | ● | ○ | ● |
| Embedded Wafer Level Package (EWLP) | ○ | ● | ○ | ● |
| Underfill | ||||
| Capillary Underfill (CUF) | ○ | ○ | ● | ● |
| Molded Underfill (MUF) | ○ | ○ | ● | ● |
| Potting | ||||
| Potting | ○ | ○ | ● | ● |
| Moldiverse | ||||
| Material Hub Cloud (MHC) – 1 Year Subscription | ● | ● | ● | ● |
| University – Moldex3D Software Training – 1 Year Subscription | ● | ● | ● | ● |
Suite Selection Guide:
The Professional Suite provides the core IC packaging simulation environment. The Compression Suite is focused on compression molding, NUF and EWLP processes. The Dispensing Suite is suited to underfill and potting applications. The Premium Suite provides the broadest combination of IC packaging molding-process capabilities. Optional module availability should be confirmed based on the final Moldex3D commercial configuration and license quotation.
The Professional Suite provides the core IC packaging simulation environment. The Compression Suite is focused on compression molding, NUF and EWLP processes. The Dispensing Suite is suited to underfill and potting applications. The Premium Suite provides the broadest combination of IC packaging molding-process capabilities. Optional module availability should be confirmed based on the final Moldex3D commercial configuration and license quotation.